White Papers

Direct from

Development

PowerEdge Product Group

In addition to improving airflow and enhancing cooling, use of Direct Orthogonal Connectors in the PowerEdge

MX7000 enables the formation of a comprehensive interconnection for high speed signal transmission between

compute/storage modules and switch (I/O) modules, as well as for effective power delivery to these modules. Figure 4

below illustrates direct orthogonal interconnections between a vertical Compute Module and horizontal Switch Module,

as well as power delivery using both Vertical and Horizontal Power Distribution PWA’s to those modules:

Figure 4: Schematic showing orthogonal power connectors for horizontal switch modules and vertical compute/storage modules.

Conclusion

While earlier servers and modular systems relied on a traditional midplane architecture, implementation of innovative

Direct Orthogonal Connectors in the new PowerEdge MX7000 eliminates the midplane and greatly optimizes airflow

through the compute and switch modules. This enhances cooling and ensures that current and future high-power

processors and DIMM’s can be cooled more effectively, even at high ambient temperatures. Additionally, signal

integrity will be optimal without being compromised by long Printed Circuit Board (PCB) traces, allowing for high speed

signals (including PCIe Gen 4).

 For more information about airflow and cooling in the new PowerEdge MX7000, including its Multiple Airflow Zone design, see

the Direct from Development tech note, PowerEdge MX7000 Chassis Thermal Airflow Architecture.

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