Technical Guide
Table Of Contents
- Dell EMC PowerEdge R650xs Technical Guide
- Contents
- System overview
- System features and generational comparison
- Chassis views and features
- Processor
- Memory subsystem
- Storage
- Networking
- Expansion cards and expansion card risers
- Power, thermal, and acoustics
- Rack, rails, and cable management
- Supported Operating Systems
- Dell EMC OpenManage systems management
- Dell Technologies Services
- Dell EMC ProDeploy Enterprise Suite
- Dell EMC Remote Consulting Services
- Dell EMC Data Migration Service
- Dell EMC ProSupport Enterprise Suite
- Dell EMC ProSupport Plus for Enterprise
- Dell EMC ProSupport for Enterprise
- Dell EMC ProSupport One for Data Center
- ProSupport for HPC
- Support Technologies
- Dell Technologies Education Services
- Dell Technologies Consulting Services
- Dell EMC Managed Services
- Appendix A: Additional specifications
- Appendix B. Standards compliance
- Appendix C Additional resources
System overview
The Dell EMC™ PowerEdge™ R650xs is Dell's latest 2-socket, 1 U rack servers designed to run complex workloads using highly
scalable memory, I/O, and network options. The systems feature the 3rd Generation Intel® Xeon Scalable Processor , up to 16
DIMMs, PCI Express
®
(PCIe) 4 .0 enabled expansion slots, and a choice of network interface technologies to cover NIC.
The PowerEdge R650xs is a general-purpose platform capable of handling demanding workloads and applications, such as data
warehouses, ecommerce, databases, and high-performance computing (HPC).
Topics:
• Key workloads
• New technologies
Key workloads
The target workloads for the PowerEdge R650xs include virtualization, public/private cloud, scale-out database, and high-
performance compute .
New technologies
Table 1. New technologies
Technology Detailed Description
3rd Generation Intel® Xeon Scalable
Processor
Core count: Up to 32 per processor
UPI speed: Up to 3x UPIs/Socket at 10.4 GT/s or 11.2 GT/s
Maximum number of PCIe lanes: Integrated 64 PCIe 4.0 lanes @ 16 GT/s PCIe
Gen4
Maximum TDP: 220 W
3200 MT/s DDR4 Memory
Maximum 8 DIMMs per processor and 16 DIMMs in total
Supports DDR4 ECC RDIMM, with ECC up to 3200 MT/s
Flex I/O
LOM board, 2 x 1 GB with BCM5720 LAN controller
Rear IO with 1 GB Dedicated Management Network Port, USB 3.0 x1, USB 2.0 x1
and VGA port
OCP Mezz 3.0 (supported by x16 PCIe lanes)
Serial port option
Dedicated PERC Front storage module PERC with front PERC 10.5 and PERC 11
Software RAID OS RAID / S150
Power Supplies 60 mm dimension is the new PSU form factor on 15G design
● 600 W DC/240 V
● 600 W Platinum AC/100 - 240 V
● 800 W DC/240 V
● 800 W Platinum AC/100 - 240 V
1
System overview 5