Reference Guide

Table 17. Thermal restrictions configuration (continued)
Configuratio
n
Number
of
processo
rs
Heatsink Processor/DIMM
blank
DIMM
blanks
Type of air
shroud
Fan
Two 2U standard heat sink
for CPU > 125 W
PowerEdge
R740 with
GPU
2 Two 1U high performance
heat sink
Not required Not
required
GPU air shroud Six high
performance
fans
Ambient temperature limitations
The following table lists configurations that require ambient temperature less than 35°C.
NOTE: The ambient temperature limit must be adhered to ensure proper cooling and to avoid excess CPU throttling, which
may impact system performance.
Table 18. Configuration based ambient temperature restrictions
System Front backplane Processor
Thermal
Design Power
(TDP)
Processor heat
sink
Fan type GPU Ambient
restriction
PowerEdge
R740
8 x 3.5 inch SAS/
SATA
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high
performance
High
performance fan
≥1 double-
width/single-
width
30°C
8 x 2.5 inch SAS/
SATA
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high
performance
High
performance fan
≥1 double-
width/single-
width
30°C
16 x 2.5 inch
SAS/SATA
150 W/8 core,
165 W/12 core,
200 W, 205 W
1U high
performance
High
performance fan
≥1 double-
width/single-
width
30°C
Particulate and gaseous contamination specifications
The following table defines the limitations that help avoid any equipment damage or failure from particulate and gaseous
contamination. If the levels of particulate or gaseous pollution exceed the specified limitations and result in equipment damage
or failure, you may need to rectify the environmental conditions. Remediation of environmental conditions is the responsibility of
the customer.
Table 19. Particulate contamination specifications
Particulate contamination Specifications
Air filtration Data center air filtration as defined by ISO Class 8 per ISO 14644-1
with a 95% upper confidence limit.
NOTE: The ISO Class 8 condition applies to data center
environments only. This air filtration requirement does not apply to
IT equipment designed to be used outside a data center, in
environments such as an office or factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles.
NOTE: This condition applies to data center and non-data center
environments.
Technical specifications 15