Owners Manual

Particulate and gaseous contamination specications
Table 19. Particulate contamination specications
Particulate contamination Specications
Air ltration Data center air ltration as dened by ISO
Class 8 per ISO 14644-1 with a 95% upper
condence limit.
NOTE: This condition applies only to data center environments. Air ltration requirements do not apply to IT equipment
designed to be used outside a data center, in environments such as an oce or factory oor.
NOTE: Air entering the data center must have MERV11 or MERV13 ltration.
Conductive dust Air must be free of conductive dust, zinc
whiskers, or other conductive particles.
NOTE: This condition applies to data center and non-data center environments.
Corrosive dust Air must be free of corrosive dust.
Residual dust present in the air must have a deliquescent point less than 60% relative humidity.
NOTE: This condition applies to data center and non-data center environments.
Table 20. Gaseous contamination specications
Gaseous contamination Specications
Copper coupon corrosion rate <300 Å/month per Class G1 as dened by ANSI/ISA71.04-1985.
Silver coupon corrosion rate <200 Å/month as dened by AHSRAE TC9.9.
NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.
Standard operating temperature specications
NOTE
:
1 Not available: Indicates that the conguration is not oered by Dell EMC.
2 Not supported: Indicates that the conguration is not thermally supported.
NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with sucient
thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these
tables except for the Mellanox DP LP card.
18 Technical specications