Owners Manual
Table Of Contents
- Dell EMC PowerVault ME4 Series Storage System Owner’s Manual
- Contents
- Storage system hardware
- Troubleshooting and problem solving
- Module removal and replacement
- ESD precautions
- Dealing with hardware faults
- Firmware updates
- Continuous operation during replacement
- Shutting down attached hosts
- Shutting down a controller module
- Verifying component failure
- Customer-replaceable units (CRUs)
- Attach or remove the front bezel of a 2U enclosure
- Replacing a drive carrier module in a 2U enclosure
- Replacing a DDIC in a 5U enclosure
- Replacing a controller module or IOM in a 2U or 5U enclosure
- Replacing a power supply unit (PSU) in a 5U enclosure
- Replacing a fan cooling module (FCM) in a 5U enclosure
- Replacing a power cooling module (PCM) in a 2U enclosure
- Completing the component installation process
- Verifying component operation
- Performing updates in PowerVault Manager after replacing an FC or SAS HBA
- Events and event messages
- Connecting to the CLI port using a serial cable
- Technical specifications
- Standards and regulations
Table 20. 2U alarm conditions (continued)
Status Severity Alarm
Insufficient power available Warning None
For details about replacing modules, see Replacing a controller module or IOM in a 2U or 5U enclosure on page 60.
NOTE: Using the PowerVault Manager, monitor the storage system event logs for information about enclosure-related
events, and to determine any necessary recommended actions.
PCM faults
Table 21. PCM recommended actions
Symptom Cause Recommended action
Ops panel Module Fault LED is amber
1
Any power fault Verify AC mains connections to PCM are live
Fan Fail LED is illuminated on PCM
2
Fan failure Replace PCM
1. See 12 Gb/s controller module LEDs on page 24 for visual reference of Ops panel LEDs.
2. See PCM LED states on page 33 for visual reference of PCM LEDs.
Thermal monitoring and control
The storage enclosure system uses extensive thermal monitoring and takes a number of actions to ensure component
temperatures are kept low, and to also minimize acoustic noise. Air flow is from the front to the back of the enclosure.
Table 22. Thermal monitoring recommended actions
Symptom Cause Recommended action
If the ambient air is
below 25ºC (77ºF), and
the fans are observed to
increase in speed, then some
restriction on airflow may
be causing additional internal
temperature rise.
NOTE: This is not a fault
condition.
The first stage in the thermal
control process is for the fans
to automatically increase in speed
when a thermal threshold is
reached. This may be caused by
higher ambient temperatures in the
local environment, and may be
perfectly normal.
NOTE: This threshold changes
according to the number of
disks and power supplies
installed.
1. Check the installation for any airflow restrictions at
either the front or back of the enclosure. A minimum
gap of 25 mm (1") at the front and 50 mm (2") at the
rear is recommended.
2. Check for restrictions due to dust build-up. Clean as
appropriate.
3. Check for excessive re-circulation of heated air from
rear to front. Use of the enclosure in a fully enclosed
rack is not recommended.
4. Verify that all blank modules are in place.
5. Reduce the ambient temperature.
Thermal alarm
Table 23. Thermal alarm recommended actions
Symptom Cause Recommended action
1. Ops panel Module Fault LED is
amber.
2. Fan Fail LED is illuminated on one
or more PCMs.
Internal temperature
exceeds a preset
threshold for the
enclosure.
1. Verify that the local ambient environment temperature
is within the acceptable range. See also Environmental
requirements on page 152.
2. Check the installation for any airflow restrictions at either
the front or back of the enclosure. A minimum gap of
25 mm (1") at the front and 50 mm (2") at the rear is
recommended.
3. Check for restrictions due to dust build-up. Clean as
appropriate.
Troubleshooting and problem solving 39