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Dell

PowerEdge R810

Technical Guide

Version 2

March 18, 2010

The PowerEdge R810

is designed with a

purpose—to make the

customer’s life easier.

PowerEdge gives you

the confidence to do

your job.

Summary of content (71 pages)

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Dell PowerEdge R810 Technical Guide Version 2 March 18, 2010 The PowerEdge R810 is designed with a purpose—to make the customer’s life easier. PowerEdge gives you the confidence to do your job.
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Dell This document is for informational purposes only. Dell reserves the right to make changes without further notice to any products herein. The content provided is as is and without express or implied warranties of any kind. Dell, PowerEdge, EqualLogic, PowerVault, OpenManage, and ReadyRails are trademarks of Dell, Inc. Citrix® and XenServer™ are trademarks of Citrix Systems, Inc.
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Dell Table of Contents 1 Product Comparison ........................................................................................... 6 1.1 Overview .................................................................................................. 6 1.2 Comparison ............................................................................................... 7 2 New Technologies .............................................................................................. 8 2.1 Overview ................
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Dell 5.3 Power Supplies ......................................................................................... 5.4 Heat Dissipation ........................................................................................ 5.5 Environmental Specifications......................................................................... 5.6 ENERGY STAR® Compliance ........................................................................... 5.7 Thermal and Acoustics ....................................................
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Dell 12 11.5.2 System Board ..................................................................................... 41 11.5.3 Riser 2 ............................................................................................. 41 11.6 PCIe Block Diagram .................................................................................... Storage ........................................................................................................ 12.1 Overview .........................................
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Dell Tables U U U U U U U U U U U U U U U U U U U U U U Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Product Comparison .................................................................................. 7 Summary of R810 Features .......................................................................... 9 Power Supply Status Indicator .................................................................... 21 Environmental Specifications ....
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Dell 1 Product Comparison 0B 1.1 Overview 18B The Dell™ PowerEdge™ R810 provides performance and rack density in a scalable 2U, two- or foursocket server, allowing workload consolidation or high virtualization machine density. FlexMem Bridge Technology delivers compute resources; more memory per processor solves growing memory demand needs for database and virtualization applications.
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Dell The PowerEdge R810 is designed with a purpose—to make the customer’s life easier. PowerEdge gives you the confidence to do your job. 1.2 Comparison 19B The R810 does not have a direct predecessor. It is a new class of server for Dell—a highly scalable 2U 2S rack server intended to fill the gap between the general purpose 2U 2S and the 4U 4S server space. The R810 is scalable to 4S if required, with 32 DIMM slots available in both 2S and 4S configurations.
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Dell 2 New Technologies 1B 2.1 Overview 20B The R810 uses a number of new technologies     Intel 7500 chipset Intel processor 6500 and 7500 series Dell patent-pending FlexMem Bridge Internal Dual SD module 2.2 Detailed Information 21B 2.2.1 Intel 7500 Chipset 101B The 7500 chipset is designed to support Intel® Xeon® processor 6500 and 7500 series 4S family, Intel® QPI Interconnect, DDR3 memory technology, and PCI Express Generation 2 (PCIe 2).
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Dell 3 System Information 2B Table 2.
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Dell Intel® 10GbE Single Port 10GbE NIC, Copper, PCIe-8 Broadcom® NetXtreme II 5709 Gigabit NIC w/TOE & iSOE, Quad Port, Copper, PCIe-4 Broadcom® 5709 Dual Port 1GbE NIC w/TOE PCIe-4, Low Profile Broadcom® 5709 Dual Port 1GbE NIC w/TOE iSCSI, PCIe-4, Low Profile Broadcom® 5709 Dual Port 1GbE NIC w/TOE iSCSI, PCIe-4 Broadcom® NetXtreme II 5709 Gigabit NIC w/TOE & iSOE, Quad Port, Copper, PCIe-4, Low Profile Broadcom® 5709 Dual Port 1GbE NIC w/TOE PCIe-4 Broadcom® NetXtreme® II 57711 10GbE NIC w/TOE & iSOE, D
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Dell 4 Mechanical 3B 4.1 Chassis Description 22B The PowerEdge R810 chassis is a 2U rack-mount design constructed primarily of steel. It includes a handle at the rear of the chassis. The optional front bezel is also safety rated as a handle (when properly installed) so that the server can be easily lifted using the bezel and rear handle. 4.2 Chassis 23B The PowerEdge R810 fits in a rack-mount 2U chassis.
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Dell 4.3 Dimensions and Weight 24B Figure 2 details the dimensions of the R810 chassis. Xa Xb Y Za w/ bezel Za w/o bezel Zb Zc 482.4mm 443.1mm 86.4mm 35.0mm 23.5mm 717.5mm 720.6mm Figure 2. R810 Chassis Dimensions The R810 maximum configuration weight is 26.1 kg (57.54 lb) 4.4 Front Panel View and Features 25B Figure 3. Front of R810 For detailed information, see Front-Panel Features and Indicators in the Hardware Owner’s Manual.
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Dell The PowerEdge R810 supports the following USB devices: 4.5  DVD (bootable; requires two USB ports)  USB Key (bootable)  Keyboard (only one USB keyboard is supported)  Mouse (only one USB mouse is supported) Back Panel View and Features 26B Back Panel View and Features Figure 4. For detailed information, see Back-Panel Features and Indicators in the Hardware Owner’s Manual.
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Dell Chassis Side View Figure 5. 4.9 Internal Chassis Views 30B Figure 6 shows an internal view of the chassis with key features labeled. Figure 6.
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Dell 4.10 Rails and Cable Management 31B The PowerEdge R810 uses the same rails and cable management arm (CMA) as the PowerEdge R910. It does not share rails with other Dell 2U servers. Only sliding ReadyRails™ are offered for the R810.
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Dell The Cable Management Arm (shown in Figure 8) organizes the cords and cables at the back of the server and unfolds to allow the server to extend out from the rack without removing cables. Figure 8. 4.12 Front and Rear Rack Mount and Rail Views Showing CMA and Support Tray Fans 33B Six hot-swappable fans are mounted in a fan gantry that is located in the chassis behind the processors. Each fan has a blind mate 2x2 connector that plugs directly into the CPU Board.
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Dell The Embedded Server Management logic in the system monitors the speed of the fans. A fan failure or over-temperature in the system results in a notification by iDRAC6. All system fans are pulse width modulated fans. Redundant cooling is supported with one fan failing at a time. 4.13 Cabling 34B R810 cabling incorporates service loops to allow the upper front chassis to translate forward for memory access.
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Dell The LCD panel is a graphics display controlled by iDRAC6. Error codes can be sent to the display by either iDRAC6 or BIOS. BIOS will have the ability to enter a ―Secure Mode‖ through Setup, which will lock the Power and NMI buttons. When in this mode, pressing either button has no effect but does not mask other sources of NMI and power control. The control panel board is connected to the planar via a 60-wire ribbon cable and a separate 5-wire cable for USB signals only.
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Dell 4.15.7 Secure Mode BIOS has the ability to enter a secure boot mode via Setup. This mode includes the option to lock out the power and NMI switches on the Control Panel or set up a system password. 4.16 USB Key 37B An optional USB memory key installed inside your system can be used as a boot device, security key, or mass storage device. The USB connector must be enabled by the Internal USB Port option in the Integrated Devices screen of the System Setup program. Figure 10. USB Port 4.
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Dell 5 Power, Thermal, Acoustic 4B 5.1 Power Subsystem 41B The power supply subsystem supports up to two AC-DC power supplies (1+1 redundant configuration) connected directly to the planar. The power supply only provides +12V and +12Vaux. There are several voltage regulators in the system to supply different voltage levels needed by different logic devices. 5.1.
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Dell 5.3 Power Supplies 43B The base redundant system consists of two hot-plug 1100 W power supplies in a 1+1 configuration. R810 power supplies have embedded cooling fans. The PSUs have one status bi-color LED: green for AC power present and amber for a fault. LED Power Supply Status AC Power is not present AC Power is present Fault of any kind is detected DC Power is applied to the system PSU mismatch (when hotplugged/swapped) ↔ Table 3.
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Dell 5.5 Environmental Specifications 45B Table 4 details operating and storage environmental requirements. Table 4. Environmental Specifications Temperature Operating 10° to 35°C (50° to 95°F) with a maximum temperature gradation of 10°C per hour Note: For altitudes above 2950 feet, the maximum operating temperature is derated 1°F/550 ft.
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Dell  Custom-designed heat sinks maintain CPU, IOH, and chip temperatures within thermal design targets Highly Optimized Fan Control Algorithm o Base fan speeds are a function of hardware configuration and ambient temperature to minimize airflow for a given environment o Closed-loop PID control algorithms are used for both CPU and DIMMs to maintain appropriate thermal margin o Double refresh switching allows for DIMM temperature excursions up to 95°C while maintaining performance and thermal design target
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Dell Idle: Reference ISO7779 (1999) definition 3.1.7; system is running in its OS but no other specific activity. Stressed Processor: An operating mode per ISO7779 (1999) definition 3.1.6. The software SPECPower_ssj2008 is utilized to stress the processors. SPECPower is set to 50% loading. LwA – UL: The upper limit sound power level (LwA) calculated per section 4.4.2 of ISO 9296 (1988) and measured in accordance to ISO 7779 (1999). LpA: Average bystander A-Weighted sound pressure level.
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Dell 6 Processors 5B 6.1 Overview 50B The Intel Xeon processor 6500 and 7500 series 4S (Expandable Processor) is the microprocessor designed specifically for servers and workstation applications. The processor features quad-core processing to maximize performance and performance/watt for data center infrastructures and highly dense deployments.
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Dell • • • • • • Increases CPU frequency if operating below thermal, power, and current limits Streaming SIMD (Single Instruction, Multiple Data) Extension 4 Intel® 64 Technology Intel® VT‐x and VT‐d Technology for virtualization support Enhanced Intel® SpeedStep Technology Demand‐based switching for active CPU power management as well as support for ACPI P‐States, C‐States, and T-States 6.3 Supported Processors 52B Table 7. Supported Processors Model Speed TDP Power Cache Cores QPI Speed X7560 2.
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Dell to four DDR3 DIMMs. In a typical Intel Xeon processor 6500/7500 series configuration, only the memory buffers associated with the two populated sockets would be connected, and therefore only 16 DIMMs would be accessible. To overcome this limitation with 2 CPUs, the R810 uses the FlexMem Bridge which allows CPU1 and CPU2 to connect to the memory of their respective adjacent sockets (CPU3 and CPU4).
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Dell 7 Memory 6B 7.1 Overview 55B The PowerEdge R810 uses DDR3 memory providing a high-performance, high-speed memory interface capable of low latency response and high throughput. The R810 supports Registered ECC DDR3 DIMMs (RDIMM). The DDR3 memory interface consists of 8 Intel® 7500 Scalable Memory Buffers (Intel® 7500 SMBs), each of which has two DDR3 memory channels. Each channel supports up to two RDIMMs for single/dual/quad rank.
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Dell  Clock gating (CKE) to conserve power when DIMMs are not accessed  Low power self-refresh mode for DIMMs  I2C access to SPD EEPROM for access to RDIMM thermal sensors  Single-Bit Error Correction  SDDC (Single Device Data Correction—x4 or x8 devices)  Support for Closed Loop Thermal Management on RDIMMs  Multi-Bit Error Detection  Support for Memory Mirroring in limited configurations  Support for Memory (Rank) Sparing in limited configurations 7.
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B8 B4 B6 B2 M B CPU4 Dell CPU2 B7 B3 B5 B1 A2 A6 A4 A8 M B M B A1 A5 A3 A7 M B C1 C1 C5 C3 C7 3 CPU4 M B D7 D3 D5 D1 D1 C2 C6 C4 C8 M B 1 CPU1 M B 2 7.6 M B D8 D4 D6 D2 4 CPU VR AREA Figure 13. R810 DIMM Naming and Numbering Memory Access 60B See System Memory in the Hardware Owner’s Manual for information.
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Dell Figure 14. Drive Bay Memory Access 7.7 FlexMem Bridge 61B See Section 7.7 for details on FlemMem bridge. Figure 15.
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Dell 7.8 Memory RAS Support 62B The Intel Xeon processor 6500 and 7500 series supports high-availability memory modes including rank and DIMM sparing as well as memory mirroring. The R810 supports rank sparing only and mirroring as shown in Table 8. Table 8. PowerEdge R810 Sparing and Mirroring Sparing Type Mirroring Rules enforced Rank The capacity of the spare rank must be greater than that of any other rank on the channel 7.8.
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Dell MBOX0 MBOX0 CPU2 MBOX1 MBOX0 MBOX0 CPU3 DIMM1 DIMM2 DIMM3 DIMM4 DIMM5 DIMM6 DIMM7 DIMM8 C DIMM1 DIMM2 DIMM3 DIMM4 DIMM5 DIMM6 DIMM7 DIMM8 CPU1 MBOX1 B DIMM1 DIMM2 DIMM3 DIMM4 DIMM5 DIMM6 DIMM7 DIMM8 DIMM1 DIMM2 DIMM3 DIMM4 DIMM5 DIMM6 DIMM7 DIMM8 A D CPU4 MBOX1 MBOX1 Figure 17. R810 4P Mirroring 7.9 Memory RAID 63B Memory RAID is not supported on the PowerEdge R810. 7.10 Supported Memory Configurations 64B Table 9.
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Dell #CPU Total Memory (GB) Capacity if Rank Sparing Capacity if Mirrored DIMM size (GB) DIMM Speed 1 #DIMMs 2P+2FMB/4P 64 56 N/A 4G 16 2P+2FMB/4P 96 88 48 4G/2G 32 2P+2FMB/4P 128 120 64 4G 32 1066 2P+2FMB/4P 160 144 80 8G/4G 32 1066 2P+2FMB/4P 192 176 96 8G/4G 32 1066 2P+2FMB/4P 256 240 128 8G 32 1066 2P+2FMB/4P 256 224 N/A 16G 16 1066 2P+2FMB/4P 512 480 256 16G 32 1066 2P+2FMB /4P 96 80 N/A 4G 24 1066 2P+2FMB /4P 320 256 N/A 16G/8G 8/
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Dell 8 Chipset 7B The PowerEdge R810 system board incorporates the Intel® 7500 chipset for I/O and processor interfacing. The 7500 chipset is designed to support Intel® Xeon® processor 6500 and 7500 series 4S family, Intel® QPI Interconnect, DDR3 memory technology, and PCI Express Generation 2 (PCIe 2). The 7500 chipset consists of the IOH QuickPath Interconnect (QPI), Intel® 7500 Scalable Memory Buffer, and the ICH10 South Bridge. 8.
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Dell 9 BIOS 8B 9.1 Overview 69B The R810 BIOS is based on the Dell BIOS core, and supports the following features:                  IA‐32 Intel Xeon 7500 chipset 4S Simultaneous Multi-Threading (SMT) support CPU Turbo Mode support PCI 2.3 compliant Plug-and-Play 1.0a compliant MP (Multiprocessor) 1.
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Dell 10 Embedded NICs/LAN on Motherboard (LOM) 9B The R810 LOM solution consists of Embedded Gigabit Ethernet Controllers with TCP Offload Engine (TOE) and iSCSI support. Four Gigabit Ethernet ports are provided as standard. Two embedded Broadcom 5709C dual-port LAN controllers are on the R810 planar as independent Gigabit Ethernet interface devices. The following information details the features of the LAN devices:  x4 PCI Express Gen2 capable interface ( R810 operates this controller at Gen2 speed.
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Dell 11 I/O Slots 10B 11.1 Overview 71B The R810 comes standard with a total of six PCIe GEN2 expansion card slots, plus one dedicated slot for the internal RAID controller. 11.2 Quantities and Priorities 72B See Expansion Cards and Expansion-Card Risers in the Hardware Owner’s Manual for detailed information on expansion card slot priorities and maximum number allowed. U U 11.2.1 IO Planar PCI Express Slots 116B Two low-profile PCI Express slots are provided on the IO planar.
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Dell System supports 25W maximum power for the 1st and 2nd cards and 15W for the 3rd through 6th cards.  The lower power support on the third through sixth cards is due to system thermal limitations o 11.2.3 Additional Riser Restrictions 118B  The riser connectors on the IO Board do not support plugging in a standard PCI Express card. Do not attempt this for troubleshooting.  Two R810 risers must be installed or the system will not power up.  Standard height (4.376‖)  Maximum length of 9.
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Dell Description Max Slot priority PERC 6/E Adapter w/ 512MB BB Cache 2 6,5 6Gbs SAS HBA 2 6,5,1,2 SAS 5/E Adapter 2 6,5 Broadcom® 57711 SFP+ dual-port NIC 2 6,5,1,2 Intel® D80259 10G Base-T Single Port NIC 2 6,5,1,2 Broadcom® 57710 10GBase-T Cu single-port NIC 2 6,5,1,2 Intel® Ethernet Server Adapter DA and SR 2 6,5,1,2 QLE2562—Qlogic® Dual, FC8 2 6,5,1,2 LPe-12002—Emulex® Dual, FC8 2 6,5,1,2 Qlogic® 10GBe CNA (QLE8152) 2 6,5,1,2 Emulex® 10GBe CNA OCE10102 FM (FCOE) OCE1010
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Dell 11.5 11.5.1 Description Max Slot priority Broadcom® Quad-Port 2 2,1,6,5,3,4 Intel® Cu Quad-Port 4 2,1,6,5,3,4 Broadcom® 5709 IPv6 1G Cu Dual Port NIC TOE/ISOE 4 2,1,6,5,3,4 Broadcom® 5709 IPv6 1G Cu Dual Port NIC TOE 4 2,1,6,5,3,4 PCI Card Dimensions 75B Riser 1 119B Slot 1: x8 link expansion slot (24.13 cm [9.5"] length) Slot 2: x4 link expansion slot (low-profile 16.76 cm [6.6"] maximum length, with a standard height bracket) 11.5.
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Dell 11.6 PCIe Block Diagram 76B Figure 18.
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Dell 12 Storage 11B 12.1 Overview 77B The PowerEdge R810 supports up to six 2.5‖ hard disk drives:    Support for 7,200 rpm, 10,000, and 15,000 rpm 2.5‖ SAS drives Support for 7,200 rpm, 2.5‖ SATA drives Support for SATA 2.5‖ solid state drives Internal Storage adapters do not allow mixing of drive types within the same container. See Table 11 for more information. Table 11.
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Dell Figure 19. Persistent Storage Block Diagram 12.2.1 iDRAC6 Express 122B The iDRAC6 Express is a managed persistent storage space for server provisioning data. iDRAC6 Express consists of 1 GB flash and vFlash (an optional external SD card on the optional iDRAC6 Enterprise). vFlash offers the hot-plug portability and increased storage capacity benefits of SD while still being managed by the system.
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Dell  Life Cycle Log (2 MB): stores initial factory configuration as well as all detectable hardware and firmware changes to the server since its deployment. The Life Cycle Log is stored on the BMC SPI flash. Approximately 20% of the flash space is reserved for wear leveling on the NAND flash. Wear leveling is a method designed to extend the life of the NAND flash by balancing the use cycles on the flash’s blocks. 12.2.2 12.2.2.
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Dell The Internal SD Module is dedicated for an SD Flash Card with embedded Hypervisor for virtualization. The SD Flash Card contains a bootable OS image for virtualized platforms. The microcontroller has a USB 2.0 interface to the control panel (via 1x12 cable) and SD card controller that interfaces the SD Flash Cards. When two SD Flash Cards are used, the controller can use the two flash cards as redundant configuration.
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Dell Table 13. Single Drive Type RAID Configurations Config Type Configs Description Min HDD Max HDD No HDD 0 NZC No controller/No hard drive 2.5‖ = 0 2.5‖ = 0 SAS/SATA/SSD– No Raid 1 MSS Integrated SAS/SATA: PERC H200, No RAID 2.5‖ = 1 2.5‖ = 6 SAS/SATA/SSD RAID 2 MSSR0 Integrated SAS/SATA RAID 0 ( PERC H700,PERC H200) 2.5‖ = 2 2.5‖ = 6 3 MSSR1 Integrated SAS/SATA RAID 1 (PERC H700,PERC H200) 2.5‖ = 2 2.5‖ = 2 4 MSSR5 Integrated SAS/SATA RAID 5 ( PERC H700) 2.5‖ = 3 2.
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Dell Table 14. Mixed SSD and SAS RAID Configurations Config Type Configs SSD/SAS RAID 12.6 Description Mixed SSD/SAS Min 2xSSD+2xSAS 2.5”:Max 2xSSD + 4xSAS Min Max 7 MSSR1/R1-X Integrated SSD/SAS RAID 1/RAID 1 (PERC H700) 2.5‖ = 2+2 2.5‖ = 2+2 8 MSSR1/R5-X Integrated SSD/SAS RAID 1/RAID 5 (PERC H700) 2.5‖ = 2 + 3 2.5‖ = 2 + 4 9 MSSR1/R10-X Integrated SSD/SAS RAID 1/RAID 10 (PERC H700) 2.5‖ = 2 + 4 2.5‖ = 2 + 4 Storage Controllers 82B 12.6.
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Dell Table 15.
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Dell 13 Video and Audio 12B 13.1 Video 86B The R810 Integrated Dell Remote Access Controller 6 (iDRAC6) incorporates an integrated video subsystem, connected to the 32-bit PCI interface of the ICH10. This logic is based on the Matrox® G200. The device only supports 2D graphics. The video device outputs are multiplexed between the front and rear video ports.
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Dell 14 Rack Information 13B 14.1 Overview 88B The ReadyRails™ sliding rail system for the R810 provides toolless support for racks with square or unthreaded round mounting holes including all generations of Dell racks. The optional cable management arm (CMA) can be mounted on either the left or right side of the sliding rails without the use of tools for fast and easy deployment.
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Dell *Adapter brackets are available from RackSolutions that allow the R810 sliding rails to mount in threaded racks. The only option available for 2-post racks is to mount the system on a fixed shelf. Other factors to consider when deploying the R810 include the spacing between the front and rear mounting flanges of the rack, the type and location of any equipment mounted in the back of the rack such as power distribution units (PDUs), and the overall depth of the rack.
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Dell Figure 22. R810 Mounted in the B2 Sliding Rails The R810 CMA can be mounted to either side of the rails without the use of tools or the need for conversion, but it is recommended that it be mounted on the side opposite the power supplies to allow easier access to the power supplies for service or replacement. Figure 23.
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Dell 15 Operating Systems 14B See www.dell.com/ossupport for the most current operating system support matrix.
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Dell 16 Virtualization 15B The R810 system is designed specifically for virtualization. This is enabled through the virtualization features of the processors and the optimization of memory and I/O for the virtualization use case. Several hypervisor versions are supported as shown below. The Internal Dual SD module provides redundancy and fail-over for embedded hypervisors.
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Dell 17 Systems Management 16B 17.1 Overview 92B Dell delivers open, comprehensive, and integrated solutions that help you reduce the complexity of managing disparate IT assets. Combining Dell PowerEdge Servers with a wide selection of Dell developed systems management solutions gives you choice and flexibility, so you can simplify and save in IT environments of any size.
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Dell DVD. This DVD has an inventory tool for managing updates to firmware, BIOS and drivers for either Linux or Windows varieties. 17.3 Embedded Server Management 94B The PowerEdge R810 implements circuitry for the next generation of Embedded Server Management. It is Intelligent Platform Management Interface (IPMI) v2.0 compliant. The iDRAC (Integrated Dell Remote Access Controller) is responsible for acting as an interface between the host system and its management software and the periphery devices.
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Dell 17.5 Integrated Dell Remote Access Controller 96B The integrated Dell Remote Access Controller (iDRAC6) provides IT Administrators comprehensive yet straightforward management of remote servers, by delivering ―as if you are there‖ presence and control. iDRAC6 helps users to save time and money by eliminating travel to the remote server(s), whether that server is located in a different room, a different building, a different city, or in a different country.
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Dell   Support for 8GB SD storage media Can be used as a repository for a pre-OS image, eliminating the need to maintain a network infrastructure for OS deployment Can also be used for permanent diagnostics image for use after system failures, or permanent failsafe image for periodic configuration changes  A more detailed feature list for iDRAC6 Enterprise and vFlash Media is included in the table below. Table 18.
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Dell Feature BMC iDRAC 6 Express iDRAC6 Enterprise vFlash Media proxy) Power capping    Last crash screen capture    Boot capture    Serial-over-LAN    Virtual media   Virtual console   Virtual console sharing    Virtual flash Monitoring    Real-time Power Monitoring    Real-time Power Graphing    Historical Power Counters            Sensor Monitoring and Alerting  Logging Features System Event Log  RAC Log Tr
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Dell 18 Peripherals 17B 18.1 USB Peripherals 99B R810 supports the following USB devices: 18.2  DVD (bootable; requires two USB ports)  USB Key (bootable)  Keyboard (only one USB keyboard is supported)  Mouse (only one USB mouse is supported) External Storage 100B See Section 12.9 for information on external storage.
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Dell Appendix A. Technical Specifications Summary Processor Processor Type Up to Eight-Core Intel® Xeon® processors 7500 and 6500 series Expansion Bus Bus Type PCI Express Generation 2 Expansion Slots Up to 25W supported for the first two cards and 15W for the third through sixth cards IO Planar (2) half-height (low-profile) x8 link with x8 physical connector (Slots 3 and 4) Riser 1 (1) full-height, 9.
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Dell USB (4) 4-pin, USB 2.0-compliant Video (1) 15-pin VGA vFlash (1) optional vFlash memory card slot on iDRAC6 Enterprise Front Video (1) 15-pin VGA USB (2) 4-pin, USB 2.0-compliant (external) (1) 4-pin, USB 2.
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Dell Appendix B. Regulatory Certifications and Standards Compliance Regulatory compliance certificates can be located at the following site: http://www.dell.com/content/topics/global.aspx/about_dell/values/regulatory_compliance/dec_co nform?c=us&l=en&s=corp U U R810 systems conform to the industry standards shown in Table 22: Table 19. Industry Standards Standard URL for Information and Specifications ACPI http://www.acpi.info/ Advance Configuration and Power Interface Specification, v2.
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Dell Standard Firmware Interface Specification, v2.1 USB Universal Serial Bus Specification, Rev. 2.0 Windows Logo Windows Logo Program System and Device Requirements, v3.10 URL for Information and Specifications U http://www.usb.org/developers/docs/ http://www.microsoft.com/whdc/winlogo/hwrequirem ents.mspx U U Table 20. Product Safety Certifications and Marks The PowerEdge R810 has been certified and bears the Mark, as applicable, of the Product Safety authorities as indicated below.
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Dell Table 21. Electromagnetic Compatibility The product has been certified and bears the Mark, as applicable, of the EMC authorities as indicated below.
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Dell Appendix C. Statement of Volatility The Dell PowerEdge R810 contains both volatile and non-volatile (NV) components. Volatile components lose their data immediately upon removal of power from the component. Non-volatile components continue to retain their data even after the power has been removed from the component. Components chosen as user-definable configuration options (those not soldered to the motherboard) are not included in the Statement of Volatility.
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Dell provided firmware file and loader program which is executed by booting up the system from a floppy or OS-based executable containing the firmware file and the loader. System loaded with arbitrary data in firmware memory would not operate. How is this memory write protected? Software write protected Server System Event Log Memory/FRU Size: 4 Kb Type: [e.g. Flash PROM, EEPROM]: SERIAL EEPROM Can user programs or operating system write data to it during normal operation? No Purpose? [e.g.
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Dell Type: [e.g. Flash PROM, EEPROM]: EEPROM Can user programs or operating system write data to it during normal operation? No Purpose? [e.g. boot code] Store firmware for TPM functionality How is data input to this memory? Loading flash memory requires a vendor provided firmware file and loader program. System loaded with arbitrary data in firmware memory would not operate. How is this memory write protected? Software write protected Backplane Firmware and FRU Size: 32 KB Type: [e.g.
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Dell Server BMC (Baseboard Management Controller) Firmware Flash Memory Size: 16 Mb Flash Type: [e.g. Flash PROM, EEPROM]: Flash PROM Can user programs or operating system write data to it during normal operation? No Purpose? [e.g.