Technical Guide
Table Of Contents
- Dell EMC PowerEdge R550 Technical Guide
- Contents
- System overview
- System features and generational comparison
- Chassis views and features
- Processor
- Memory subsystem
- Storage
- Networking
- Expansion cards and expansion card risers
- Power, thermal, and acoustics
- Rack, rails, and cable management
- Supported Operating Systems
- Dell EMC OpenManage systems management
- Dell Technologies Services
- Dell EMC ProDeploy Enterprise Suite
- Dell EMC Remote Consulting Services
- Dell EMC Data Migration Service
- Dell EMC ProSupport Enterprise Suite
- Dell EMC ProSupport Plus for Enterprise
- Dell EMC ProSupport for Enterprise
- Dell EMC ProSupport One for Data Center
- ProSupport for HPC
- Support Technologies
- Dell Technologies Education Services
- Dell Technologies Consulting Services
- Dell EMC Managed Services
- Appendix A: Additional specifications
- Appendix B. Standards compliance
- Appendix C Additional resources
Cooling components thermal restrictions
Table 31. Thermal restrictions
Configurations Processor Fan Type/
Q’ty
HSK Type Air
Shroud
OCP
Shroud
DIMM
Blank
Process
or Blank
Rear
Configuration
SKU
8 x 3.5-inch SAS/
SATA
1 x OCP, 6 x LP
With Riser
< =150 W 5 x STD
Fan
STD HSK Yes No Yes N/A
>150 W <
=220 W
HPR HSK
16 x 2.5-inch SAS/
SATA
1 x OCP, 4 x LP
W/O Riser*
< =150 W 5 x STD
Fan
STD HSK Yes Yes No N/A
>150 W <
=220 W
HPR HSK
1 x OCP, 6 x LP
With Riser
< =150 W STD HSK No
>150 W <
=220 W
HPR HSK
8 x 2.5-inch SAS/
SATA
1 x OCP, 6 x LP
With Riser
< =150 W 5 x STD
Fan
STD HSK Yes No No N/A
>150 W <
=220 W
HPR HSK
NOTE: OCP shroud is required without riser module installed.
NOTE: Processor blank is required for 1P configuration.
46 Appendix A: Additional specifications