Datasheet

Document ID Number: 328209 003EN Intel
®
Xeon Phi™ Coprocessor Datasheet
9
2 Intel
®
Xeon Phi™ Coprocessor
Architecture
2.1 Intel
®
Xeon Phi™ Coprocessor Product Overview
The Intel
®
Xeon Phi™ coprocessor consists of the following primary subsystems:
• Many Integrated Core (MIC) coprocessor silicon and GDDR5 memory.
• System Management Controller (SMC), thermal sensors (inlet air, outlet air,
coprocessor on-die thermal, and single GDDR5 sensor) and fan (only on 3120A
and 7120A products; see SKU matrix Tab le 2-1).
• Voltage regulators (VRs) powered by the motherboard through the PCI Express*
connector, a 2x4 (150W) and a 2x3 (75W) auxiliary power connector on the east
edge of the card. Along with power through the PCI Express* connector, the 300W
SKUs need both 2x4 and 2x3 connectors to be driven by system power supplies.
The 225W SKU may be powered only through the PCI Express* connector and the
2x4 connector.
Figure 2-1. Intel
®
Xeon Phi™ Coprocessor Board Schematic
1
Notes:
1. On-board fan is available on Intel
®
Xeon Phi™ Coprocessor 3120A and 7120A SKUs only.
PCIe Gen2 x16
CHANNEL 2
DRAMGDDR
CHANNEL 3
DRAMGDDR
CHANNEL 4
DRAMGDDR
CHANNEL 6
DRAMGDDR
CHANNEL 5
DRAMGDDR
DRAMGDDR
CHANNEL 1
DRAMGDDR
CHANNEL 0
DRAMGDDR
CHANNEL 15
DRAMGDDR
CHANNEL 14
CHANNEL 13
CHANNEL 12
CHANNEL 11
CHANNEL 10
CHANNEL 9
CHANNEL 7 CHANNEL 8
DRAMGDDRDRAMGDDR
SMC
DRAM
TMP75
DRAM
Temp
DRAM
IR3725
DRAM
IR3725
DRAM
Current
DRAM
VR12
DRAM
Voltage
I2C
SMBus
I2C
2x4 – 12V 150W
2x3 – 12V 75W
PCIe 12V 65W, 3.3V 10W
XTAL
DRAM
CK505
100MHz
100MHz
DRAM
FLASH
SPI
Intel® Xeon Phi™ Coprocessor
Silicon
Power
Connectors
DRAMGDDR
DRAMGDDR
DRAMGDDR
DRAMGDDR
DRAMGDDR
Fan Control