Datasheet

Document ID Number: 328209 003EN Intel

Xeon Phi™ Coprocessor Datasheet

3.4.3 Mechanical Considerations

• In the passive Intel

Xeon Phi™ coprocessor products, the only component on the

card with IHS load is the coprocessor. The compressive load is assumed to be

approximately uniformly distributed over the IHS. The minimum load is 23lbf and

maximum load is 75lbf. The mean pressure on the IHS is 33lbf.

• Hitachi Type7 is recommended as the thermal interface material (TIM).

• The gap filler used is the Bergquist 3500S35.

• The Intel passive heat sink is designed to nominal gaps of

— GDDR: 0.3 +/- 0.1225 mm

— VR FETs: 0.511 +/- 0.1225 mm

— VR Inductors: 0.5 +/- 0.2 mm

Ta b le 3- 4 shows the maximum heights of the different components on the SE10X/

7120X and 7120D/5120D products, along with the heights used in the product board

design. Figure 3-18 and Figure 3-19 show the front and back sides of the SE10X/7120X

SKU. Refer to the Intel

Xeon Phi™ Coprocessor Thermal Mechanical Models document

for the SE10X/7120X SKU. Refer to the Intel

Xeon Phi™ Coprocessor Dense Form

Factor Models document for information on 5120D SKU.

Table 3-4. Board Component Heights

Block Color

Notes:

1. Colors are in reference to Figure 3-18, Figure 3-19, Figure 3-20 and Figure 3-21.

Component Height (mils)

Min Typ Max

PCB Thickness 57 62 70

Coprocessor 171.221 177.992 184.763

GDDR Orange 47 47.25

VR Inductor Yellow 217 217

VR phase

controller

Red 35 39.37

Coprocessor VR

controller

Green 37 37

GDDR VR

controller

Pink 35 35.43

Capacitor

topside

Purple 49 49

Capacitor

backside

Light blue 83 83