Datasheet

Intel
®
Xeon Phi™ Coprocessor Datasheet Document ID Number: 328209 003EN
26
3.4 Cooling Solution Guidelines for SE10X/7120X and
7120D/5120D
The Intel® Xeon Phi™ coprocessor SE10X/7120X and 7120D/5120D SKUs are
shipped without a thermal solution, which gives system designers and integrators an
opportunity to fit these SKUs into their custom designed chassis. These SKUs have
GDDR components on the back side that must be cooled, in addition to the front side
where the coprocessor resides.This section documents thermal and mechanical
specifications and guidelines that would be useful to developers of custom designs.
3.4.1 Thermal Considerations
Figure 3-9 and Figure 3-10 show a schematic representation of the power profiles of
the Intel® Xeon Phi™ coprocessor SE10X/7120X products. Figure 3-11 to Figure 3-14
show a schematic representation of the power profiles of the 7120D/5120D product.
Figure 3-9 SE10X/7120X Power Profile for Coprocessor Intensive Workload (all values in
Watts)
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1.3 1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3 1.3 1.3 1.3
0.4
2.0
2.0
2.0
2.0
1.0
2.3
1.0
0.4
0.4
0.4
0.2
0.5
0.2
0.4
0.4
0.4
0.4
0.2
0.5
2.0
2.0
2.0
2.0
1.0
2.3
1.3 1.3
1.3 1.3 1.3 1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
1.3
GDDR
VR Inductor
VR FET
GDDR
Intel® Xeon Phi™
Coprocessor
Topside
Backside