Datasheet
Document ID Number: 328209 003EN Intel
®
Xeon Phi™ Coprocessor Datasheet
13
2.1.4 Intel® Xeon Phi™ Coprocessor Product Family
2.1.5 Intel® Xeon Phi™ Coprocessor 7120D/5120D(Dense Form
Factor)
The Intel® Xeon Phi™ coprocessor 7120D/5120D products, also known as Dense Form
Factor (DFF), are derivatives of the standard Intel® Xeon Phi™ coprocessor PCI
Express* form-factor card. The high-level features of the DFFs are:
• Maximum TDP of 270W for the 7120D and 245W for the 5120D
• GDDR on both sides of the card.
• 117.35mm(4.62”) x 149.86mm(5.9”) PCB.
• 230-pin unique edge finger designed to industry standard x24 PCI Express*
connector, PCI Express* 2.0 compliant. The unique edge finger pin definition
requires signal routing on baseboard and 12V filter per card.
• All power to the card is supplied through the connector.
• There is no auxiliary 2x4 or 2x3 power connector on the card.
• Supports vertical, straddle or right-angle mating connectors.
• On board SMC. The manageability features and software capabilities remain the
same as for other Intel® Xeon Phi™ coprocessor products.
• To allow for system design innovation and differentiation, Intel will ship only the
assembled and fully functional PCB, without heatsink or chassis retention
mechanism. This allows system designers to implement their own cooling solution
and connector of choice. Due to presence of GDDR5 memory components on the
backside of the DFF board, a custom cooling design must comprehend both sides of
the DFF product.
• Baseboard designers must ensure the signal integrity of all PCI Express* signals as
they pass the connector of choice and reach the connector fingers of the DFF
product.
Table 2-1. Intel® Xeon Phi™ Coprocessor Product Family
SKU Card TDP (Watts) Cooling Solution
1
Notes:
1. Passive cooling solution uses topside heatsink (vapor chamber and copper fins) and backside aluminum plate. Active
cooling uses on-card dual-intake blower.
3120A 300 Active
3120P / 7120P / SE10P 300 Passive
2,4
2. SE10P/SE10X are limited edition one-time only SKUs.
7120X / SE10X 300 None
2,3,4
3. Same performance and card configuration as the 7120P/SE10P but without Intel heatsink or chassis retention
mechanism; allows for custom thermal and mechanical design by users.
4. 7120P/7120X feature Turbo.
31S1P 270 Passive
7120A 270 Active
7120D 270 None
6
5120D 245 None
5
5. Dense Form Factor (DFF): Smaller physical footprint than the other Intel® Xeon Phi™ coprocessor products, for
innovative platform designs with unique PCI Express* interface, PCI Express* 2.0 specification compliant.
5110P
6
6. Refer to Section 5.1 for note on total card TDP of 5110P.
225 Passive