User Manual
Table Of Contents
- Dell EMC PowerEdge R750 Installation and Service Manual
- Contents
- About this document
- System overview
- Initial system setup and configuration
- Minimum to POST and system management configuration validation
- Installing and removing system components
- Safety instructions
- Before working inside your system
- After working inside your system
- Recommended tools
- Cable routing
- M.2 SSD module
- Optional front bezel
- System cover
- Drive backplane cover
- Air shroud
- Removing the air shroud
- Installing the air shroud
- Removing the GPU air shroud
- Installing the GPU air shroud
- Removing the GPU air shroud top cover
- Installing the GPU air shroud top cover
- Removing the GPU air shroud filler
- Installing the GPU air shroud filler
- Removing the rear drive module air shroud
- Installing the rear drive module air shroud
- Cooling fans
- Side wall brackets
- Drives
- Rear drive module
- Drive backplane
- PERC module
- System memory
- Processor and heat sink module
- Expansion cards and expansion card risers
- Expansion card installation guidelines
- Removing the expansion card risers
- Installing the expansion card risers
- Removing expansion card from the expansion card riser
- Installing an expansion card into the expansion card riser
- Removing the full length expansion card risers
- Installing the full length expansion card risers
- Removing a GPU
- Installing a GPU
- Removing R1 and R3 paddle cards
- Installing R1 and R3 paddle cards
- Optional serial COM port
- Optional VGA port for liquid cooling module
- Optional IDSDM module
- MicroSD card
- Optional BOSS S2 module
- System battery
- Optional internal USB card
- Intrusion switch module
- Optional OCP card
- Power supply unit
- Trusted Platform Module
- System board
- LOM card and rear I/O board
- Control panel
- Upgrade Kits
- Jumpers and connectors
- System diagnostics and indicator codes
- Getting help
- Documentation resources
Figure 112. Applying thermal grease
6. For new heat sink, remove the Thermal Interface Material (TIM) protective film from the base of heat sink.
Figure 113. Removing the Thermal Interface Material (TIM) protective film
7. Place the heat sink on the processor and press the base of the heat sink until the retaining clip locks onto the heat sink at all
the four corners.
CAUTION: To avoid damaging the fins on the heat sink, do not press down on the heat sink fins.
114 Installing and removing system components