Product Data Sheet / Brochure

Table 30. Restrictions with shroud, heat sink, and riser cage (continued)
PCIe
card
type
Form factor Fan Processor heat
sink
Shroud Riser cage
long
short
long
Non-GPU FL
HL 1U-STD or 2U-HPR STD shroud short
Thermal air restrictions
ASHRAE A3 environment for air cooling configuration
Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe SSD is not supported.
BPS, 128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
Processor TDP greater than 165 W are not supported.
HPR SLVR fans are required.
Front storage is not supported in 12x3.5-inch SAS configuration.
Rear drives are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP 3.0 card is supported with 85°C active optic cable.
BOSS 1.5 card is supported.
ASHRAE A4 environment for air cooling configuration
Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe SSD is not supported.
BPS, 128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
Processor TDP greater than 120 W are not supported.
HPR SLVR fans are required.
Front storage is not supported in 12x3.5-inch SAS configuration.
Rear drives are not supported.
BOSS 1.5 is not supported.
OCP 3.0 card is supported with 85°C active optic cable and cards tier 4.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
ASHRAE A3 environment for liquid cooling configuration
Two PSUs are required in redundant mode. If there is PSU failure, system performance may be reduced.
PCIe SSD is not supported.
BPS, 128 GB or greater capacity DIMMs are not supported.
GPU and FPGA are not supported.
Rear drives are not supported.
Non-Dell qualified peripheral cards and/or peripheral cards greater than 25 W are not supported.
OCP 3.0 card is supported with 85°C active optic cable.
BOSS 1.5 card is supported.
Technical specifications
25