Product Data Sheet / Brochure

Table 29. Thermal restriction matrix for liquid cooling systems (continued)
Configuration 8 x 2.5-
inch
NVMe and
No
Backplane
16 x 2.5-
inch SAS/
SATA
16 x 2.5-
inch NVMe
24 x 2.5-
inch SAS/
SATA
16 x 2.5-inch +
8 x 2.5-inch
NVMe
24 x 2.5-
inch NVMe
12 x 3.5-
inch SAS/
SATA
Rear storage No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
A40 (max 2)
GPU +
256 GB
LRDIMM
A100 (max
2)
HPR GOLD fan¹
Not supported
T4 (max 6) HPR GOLD fan
4
Not
supported
M10 (max 2)
Not supported
A40 (max 2)
GPU +
BPS +
≤128 GB
DIMM
A100 (max
2)
HPR GOLD fan
4
Not
supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
GPU +
BPS +
256 GB
LRDIMM
A100 (max
2)
HPR GOLD fan
4
Not supported
T4 (max 6)
M10 (max 2)
A40 (max 2)
NOTE: ¹ for ASHRAE A2 category (35°C), ² for ASHRAE A3 category (40°C), ³ for ASHRAE A4 (45°C) and
4
for ASHRAE
A2 category with 30°C ambient temperature restriction.
NOTE: Liquid cooling is not supported on rear drive configurations.
NOTE: DIMM blank is not required for liquid cooling configurations.
NOTE: All the configuration are required to have six fans installed.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without
thermal impact.
Other restriction for liquid cooling configurations
● 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.
Shroud, heat sink, and riser cage restriction
Table 30. Restrictions with shroud, heat sink, and riser cage
PCIe
card
type
Form factor Fan Processor heat
sink
Shroud Riser cage
GPU FL Configuration
dependency
T-type (1U-EXT) GPU shroud long
HL short
24 Technical specifications