Product Data Sheet / Brochure

NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without
thermal impact.
Other restrictions for air cooling configurations
● Kioxia CM6/CD6 NVMeSSD are not supported on rear drive module.
● Samsung 1733v2/1735v2 NVMeSSD are not supported on 12 x 3.5-inch rear drive module.
● ICX XCC Platinum 8368Q 270W-38C CPU in air cooling system is not supported.
● 25 Gb and above PCIe or OCP cards require high temperature (85°C) active optics cable.
●
Requires 2U-HPR HSK(8F34X) to support "ICX HCC Gold 6334 165W-8C CPU" in non-GPU configuration.
● Requires HPR GOLD fan to support BOSS-S1 on 2.5-inch configuration and not supported on 3.5-inch configuration.
Thermal restriction for liquid cooling systems
Table 29. Thermal restriction matrix for liquid cooling systems
Configuration 8 x 2.5-
inch
NVMe and
No
Backplane
16 x 2.5-
inch SAS/
SATA
16 x 2.5-
inch NVMe
24 x 2.5-
inch SAS/
SATA
16 x 2.5-inch +
8 x 2.5-inch
NVMe
24 x 2.5-
inch NVMe
12 x 3.5-
inch SAS/
SATA
Rear storage No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
No Rear
Drives
Memory 8 GB
RDIMM
STD fan¹
STD fan³
STD fan¹
STD fan²
STD fan¹ STD fan¹
HPR SLVR
fan²
16 GB
RDIMM
32 GB
RDIMM
64 GB
RDIMM
128 GB
LRDIMM
STD fan¹ STD fan¹
HPR SLVR
fan¹
256 GB
LRDIMM
HPR GOLD fan¹
Not
supported
Not
supported
BPS +
RDIMM or
LRDIMM
8 GB
RDIMM
HPR GOLD fan¹
Not
supported
16 GB
RDIMM
32 GB
RDIMM
64 GB
RDIMM
128 GB
LRDIMM
256 GB
LRDIMM
GPU +
≤128 GB
DIMM
A100 (max
2)
HPR SLVR
fan¹
HPR GOLD fan¹
Not
supported
T4 (max 6)
M10 (max 2)
Technical specifications 23