Product Data Sheet / Brochure

Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU) (continued)
Configurati
on
8 x 2.5-inch
NVMe and
No
Backplane
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear
storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
225
W
230
W
235
W
240
W
250
W
265
W
270
W
30°C
NOTE: For all CPU TDP (105 W- 270 W) request HPR GOLD fan, T-Type HSK and processor HSK blank for 2.5-inch
configurations.
NOTE: x8 BKP thermal restriction can cover No Backplane configuration, this configuration increase ~ 10% airflow without
thermal impact.
Table 27. Thermal restriction with ≤128 GB DIMM (GPU)
Configurat
ion (Front
storage)
Fan
type
CPU
TDP/
cTDP
GPU (Ambient temperature)
A100 (80G) A100
A40 (max
2)
A30 A10
M10 (max
2)
T4 (max
6)
8 x 2.5-
inch NVMe
and No
Backplane
HPR
SLVR
fan
270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-
inch SAS
HPR
GOLD
fan
270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
16 x 2.5-
inch NVMe
HPR
GOLD
fan
270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
24 x 2.5-
inch SAS
HPR
GOLD
fan
270 W 35°C 35°C 35°C 35°C 35°C 35°C 30°C
Technical specifications 21