Product Data Sheet / Brochure
Table Of Contents
- Dell EMC PowerEdge R750 Technical Specifications
- Contents
- Technical specifications
- Chassis dimensions
- Chassis weight
- Processor specifications
- PSU specifications
- Supported operating systems
- Cooling fan specifications
- System battery specifications
- Expansion card riser specifications
- Memory specifications
- Storage controller specifications
- Drive specifications
- Ports and connectors specifications
- Video specifications
- Environmental specifications
Table 25. Thermal restriction matrix with BPS + ≤128 GB DIMM (Non-GPU) (continued)
Configuratio
n
8 x 2.5-inch
NVMe and
No
Backplane
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear
storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
265
W
35°C
270
W
35°C
Table 26. Thermal restriction matrix with BPS + 256 GB LRDIMM(Non-GPU)
Configurati
on
8 x 2.5-inch
NVMe and
No
Backplane
16 x
2.5-
inch
SAS/
SATA
16 x
2.5-
inch
NVMe
24 x 2.5-inch SAS/
SATA
16 x
2.5-
inch
SAS +
8 x
2.5-
inch
NVMe
24 x
2.5-
inch
NVMe
12 x 3.5-inch SAS/
SATA
Ambie
nt
tempe
rature
Rear
storage
No Rear
Drives
No
Rear
Drives
No
Rear
Drives
No
Rear
Drive
s
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
No
Rear
Drives
No
Rear
Drives
No
Rear
Drives
2 x
Rear
2.5-
inch,
no
rear
fan
4 x
Rear
2.5-
inch
with
fan
CPU
TDP/
cTDP
105
W
HPR GOLD fan Not supported
30°C
120
W
30°C
125
W
30°C
135
W
30°C
140
W
30°C
150
W
30°C
165
W
30°C
185
W
30°C
195
W
205
W
20 Technical specifications