Datasheet

DTM63356H
4 GB - 240-Pin Registered DDR2 DIMM ECC with CMD/ADD Parity
Document 06120, Revision A, 16-Feb-11, Dataram Corporation 

 2011 Page 11
50
DRAM Case Temperature Rise from Ambient due to Precharge/Quiet Standby
(DT2N/DT2Q). (C).
0 00
51
DRAM Case Temperature Rise from Ambient due to Precharge Power-Down
(DT2P). (Degree C).
0 00
52
DRAM Case Temperature Rise from Ambient due to Active Standby (DT3N).
(Degree C).
0 00
53
DRAM Case temperature Rise from Ambient due to Active Power-Down with
Fast PDN Exit (DT3Pfast). (Degree C).
0 00
54
DRAM Case temperature Rise from Ambient due to Active Power-Down with
Slow PDN Exit (DT3Pslow). (Degree C).
0 00
DRAM Case Temperature Rise from Ambient due to Page Open Burst
Read/DT4R4W Mode Bit (DT4R/DT4R4W Mode Bit). (Degree C).
00
Bit 0. "0" if DT4W is greater than DT4R - 0
55
DT4R, ( Bits 1:7 ) - 0
56
DRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B).
(Degree C).
0 00
57
DRAM Case Temperature Rise from Ambient due to Bank Interleave Reads
with Auto-Precharge (DT7). (C).
0 00
58
Thermal Resistance of PLL Package from Top to Ambient (Psi T-A PLL).
(C/Watt).
0 00
59
Thermal Resistance of Register Package from Top to Ambient ( Psi T-A
Register). (C/Watt).
0 00
60
PLL Case Temperature Rise from Ambient due to PLL Active (DT PLL Active).
(Degree C).
0 00
Register Case Temperature Rise from Ambient due to Register Active/Mode Bit
(DT Register Active/Mode Bit).
00
Bit 0.If "0"Unit for Bits 2:7 is 0.75C - 0
Bit 1. RFU. Default: 0 - 0
61
Register Active,( Bits 2:7 ) - 0
62 SPD Revision
Revision 1.2
12
63 Checksum for Bytes 0-62 36
64 Module Manufacturer’s JEDEC ID Code
Dataram ID
7F
65 Module Manufacturer’s JEDEC ID Code
Dataram ID
91
66-71 Module Manufacturer’s JEDEC ID Code UNUSED 00