Datasheet
DTM63344E
2 GB, 240-Pin Unbuffered ECC DDR2 DIMM
Document 06513, Revision A, 13-MAR-09, Dataram Corporation © 2009 Page 9
SODIMM (67.6mm) -
Micro-DIMM (45.5mm) -
Mini RDIMM (82.0mm) -
Mini UDIMM (82.0mm) -
TBD -
TBD -
21 SDRAM Module Attributes (Refer to Byte20 for DIMM type information). 0x00
Number of active registers on the DIMM (N/A for UDIMM) - 0
Number of PLL on the DIMM (N/A for UDIMM) - 0
FET Switch External Enable - No
TBD -
Analysis probe installed - No
TBD -
22 SDRAM Device Attributes: General 0x03
Includes Weak Driver - X
Supports 50 ohm ODT - X
Supports PASR (Partial Array Self Refresh) -
TBD -
TBD -
TBD -
TBD -
TBD -
23 Minimum Clock Cycle Time at Reduced CAS Latency, CL = X-1 (ns) 3.75 0x3D
24 Maximum Data Access Time (tAC ) from Clock at CL = X- 1 (ns) 0.45 0x45
25 Minimum Clock Cycle Time at CL = X-2 (ns) UNUSED 0x00
26 Maximum Data Access Time (tAC ) from Clock at CL = X-2 (ns) UNUSED 0x00
27 Minimum Row Precharge Time (tRP ) (ns) 15 0x3C
28 Minimum Row Active to Row Active Delay (tRRD ) (ns) 7.5 0x1E
29 Minimum RAS to CAS Delay (tRCD ) (ns) 15 0x3C
30 Minimum Active to Precharge Time (tRAS ) (ns) 45 0x2D
31 Module Rank Density 1GB 0x01
32 Address and Command Setup Time Before Clock (tIS) (ns) 0.2 0x20
33 Address and Command Hold Time After Clock (tIH) (ns) 0.27 0x27
34 Data Input Setup Time Before Strobe (tDS) (ns) 0.1 0x10
35 Data Input Hold Time After Strobe (tDH) (ns) 0.17 0x17
36 Write Recovery Time (tWR ) (ns) 15 0x3C
37 Internal write to read command delay (tWTR ) (ns) 7.5 0x1E
38 Internal read to precharge command delay (tRTP ) (ns) 7.5 0x1E
39 Memory Analysis Probe Characteristics. UNUSED 0x00
40 Extension of Byte 41(tRC) and Byte 42 (tRFC) (ns) 0x06
Add this value to byte 41 - 0
Add this value to byte 42 - 0.5
41 SDRAM Device Minimum Active to Active/Auto Refresh Time (tRC)
(ns)
60 0x3C
42 SDRAM Device Minimum Auto-Refresh to Active/Auto-Refresh
Command Period (tRFC). (ns)
127.5 0x7F
43 SDRAM Device Maximum Cycle Time (tCK max). (ns) 8 0x80