Datasheet
DTM63323
1 GB - 128Mx64, 240-Pin Unbuffered DDR2 DIMM
Document 06813, Revision F, 07-JAN-10, Dataram Corporation © 2010 Page 11
54
DRAM Case temperature Rise from Ambient due to Active Power-Down with
Slow PDN Exit (DT3Pslow). (Degree C).
UNUSED 0x00
DRAM Case Temperature Rise from Ambient due to Page Open Burst
Read/DT4R4W Mode Bit (DT4R/DT4R4W Mode Bit). (Degree C).
0x00
55 Bit 0. "0" if DT4W is greater than DT4R - 0
DT4R, ( Bits 1:7 ) - 0
56
DRAM Case Temperature Rise from Ambient due to Burst Refresh (DT5B).
(Degree C).
UNUSED 0x00
57
DRAM Case Temperature Rise from Ambient due to Bank Interleave Reads with
Auto-Precharge (DT7). (Degree C).
UNUSED 0x00
58
Thermal Resistance of PLL Package from Top to Ambient (Psi T-A PLL).
(C/Watt).
UNUSED 0x00
59
Thermal Resistance of Register Package from Top to Ambient ( Psi T-A
Register). (C/Watt).
UNUSED 0x00
60
PLL Case Temperature Rise from Ambient due to PLL Active (DT PLL Active).
(Degree C).
UNUSED 0x00
Register Case Temperature Rise from Ambient due to Register Active/Mode Bit
(DT Register Active/Mode Bit).
0x00
61 Bit 0.If "0"Unit for Bits 2:7 is 0.75C - 0.75
Bit 1. RFU. Default: 0 - 0
Register Active,( Bits 2:7 ) - 0
62 SPD Revision Revision 1.2 0x12
63 Checksum for Bytes 0-62 0x4F
64 Module Manufacturer’s JEDEC ID Code Dataram ID 0x7F
65 Module Manufacturer’s JEDEC ID Code Dataram ID 0x91
66 Module Manufacturer’s JEDEC ID Code UNUSED 0x00
73 Module Part Number D 0x44
91,92 Module Revision Code UNUSED 0x00
93,94 Module Manufacturing Date UNUSED 0x00
95-98 Module Serial Number Serial number 0x00
99-127 Manufacturer’s Specific Data UNUSED 0x00
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