User manual

Preventive Maintenance

ProMaster 2500 User Manual 5-11

Label Application

When solenoid

is selected (see Figure 5-15), low pressure air is passed to

the beam assembly. When the 2500 prepares to apply a label on a device,

the beam lowers (with low air pressure) the device on the application

plate, and then solenoid

is turned off to bleed the low pressure line. To

prevent the device from being skewed during label application, the beam

rests on the device (with its own weight and no air pressure) as it is

moved across the label.

Chip Blow-off

Devices are released from the chuck tip when vacuum is turned off and

low air pressure is activated to ensure a smooth separation. Beam

solenoid

(blow off) is activated, allowing low pressure air into the

vacuum chamber. The low pressure air does not go through the vacuum

venturi because the chamber is pressurized to 30 to 40 PSI. Instead, the air

is forced through the beam and chuck shaft, assisting the chip to separate

from the chuck tip.

Output Track Air

Low pressure air is used on the output tracks to help devices enter the

output tubes. When solenoid

is selected, low pressure air is switched to

both output tracks. An in-line valve, called the track air adjustment, is

located on the main plate to the right side of output tube holder 1. The air

level can be adjusted when the system is reconfigured between large and

small devices.

Figure 5-3

Beam Air Holes

2387-1

BEAM AIR

CYLINDER