User manual

Table of Contents
ProMaster 2500 User Manual xi
Figure 4-11. Closeup View of Input Track with 8-pin 150-mil Device Keeper Bar
Assembly Installed..........................................................................................................4-15
Figure 4-12. 8-pin 150-mil SOIC Device Keeper Bar Assembly Mounted in the
Input Track.......................................................................................................................4-16
Figure 4-13. Chuck Selection Chart.................................................................................4-16
Figure 4-14. Adjusting High and Low Air Pressure.....................................................4-17
Figure 4-15. Threading New Labels in the Dot Matrix Printer....................................4-19
Figure 4-16. Threading Labels in the Thermal Printer..................................................4-21
Figure 4-17. Installing Devices in the Tube Holder.......................................................4-23
Figure 4-18. Main Operator Screen in TaskLink............................................................4-23
Figure 4-19. Choosing a Process From Those Presented on the Screen.....................4-24
Figure 4-20. Checking the Sumcheck ..............................................................................4-25
Figure 4-21. Setting Pass Limit and Parts Per Tube ......................................................4-25
Figure 4-22. Aligning Beam to the Device......................................................................4-27
Figure 4-23. Aligning Device to the Module..................................................................4-28
Figure 4-24. Checking the Front-to-Back Alignment (looking from the perspective
of the input track)............................................................................................................4-29
Figure 4-25. Device too Close to the Front......................................................................4-30
Figure 4-26. Device too Close to the Back.......................................................................4-30
Figure 4-27. DIP Device Alignment.................................................................................4-32
Figure 4-28. TaskLink Status Screen During Device Processing.................................4-33
Figure 4-29. Task Session Summary Screen...................................................................4-34
Figure 4-30. Kits are a Series of Tasks in a Single Job...................................................4-35
Figure 4-31. Overview: Running a Kit (the number by each screen refers to the
number of the step describing it on the previous page.............................................4-37
Figure 4-32. Track Air Adjustment Knob.......................................................................4-38
Figure 5-1. Optic and Microswitch Locations..................................................................5-3
Figure 5-2. High and Low Pressure Air Lines ...............................................................5-10
Figure 5-3. Beam Air Holes...............................................................................................5-11
Figure 5-4. Power Supplies...............................................................................................5-14
Figure 5-5. Missing Character Dots in Label Printout..................................................5-22
Figure 5-6. Adjusting Label Calibration..........................................................................5-25
Figure 5-7. Print Shift (affects vertical position)............................................................5-26
Figure 5-8. Label Calibration (affects horizontal position) ..........................................5-26
Figure 5-9. Thermal Printer Ribbon Path........................................................................5-29
Figure 5-10. Diagnostics Command Tree .......................................................................5-30
Figure 5-11. Inserting the Hood Interlock Switch .........................................................5-31
Figure 5-12. Optic and Microswitch Locations..............................................................5-33
Figure 5-13. Adjusting the Dot Matrix Printer ADC Optic During Calibration.......5-35
Figure 5-14. Thermal Printer, Front View, Showing the ADC Label Optic...............5-37
Figure 5-15. Locations of the Solenoids Under the Main Plate ...................................5-38
Figure 5-16. Solenoids on the Beam (test numbers shown).........................................5-39
Figure 5-17. Location of the Motors.................................................................................5-41
Figure 5-18. Recommended Orientation of Pin 1 for DIP and PLCC Devices.........5-45
Figure 5-19. Interior View of the 2500’s Base.................................................................5-47
Figure 5-20. Print Head LEDs on Handler Controller Board ......................................5-47
Figure 5-21. Position of the 78-pin Connector on the Mass Storage Module............5-52
Figure 5-22. Test Points on the MSM 78-pin Connector...............................................5-53
Figure 5-23. Removing the Ribbon Cassette...................................................................5-58
Figure 5-24. Installing a New Dot Matrix Printer Ribbon Cassette............................5-58
Figure 5-25. Threading the Ribbon in the Thermal Printer..........................................5-59
Figure 5-26. Location of the Lead Screw and the Carriage..........................................5-63
Figure 5-27. Adjusting the Track Height ........................................................................5-64