7 4 August, 2015
Use of Lead in Electronics
Exemption
Expiry / Review
Date
Lead in soldering on PCB, the components and their finishes E/2015
Lead in solder for other application, not on PCB or glass E2010
Lead in finishes of Al-Capacitors E/2012
Lead in soldering on glass for mass-flow sensors
2
E/2014
Lead in high temperature melting solders Review 2019
Lead in compliant pin connector systems Review 2019
Lead in solder between die and carrier in flip chip packages Review 2019
Lead in solder of IC assemblies with >1cm² die and >1A/mm² Review 2014
Carry over parts without expiry date
not recom-
mended.
FlipChip
Interposer
Leiterplatte
Lotball
Lotbump
FlipChip
Interposer
Leiterplatte
Lotball
Lotbump
Expiry Dates referring to vehicle type approval
example IC packages