40 4 August, 2015
Conclusion
Today’s lead-free material technologies for semiconductor applications (die attach) are not
ready to substitute high-lead solders in power applications
Substantial development efforts have been running for 6 years now and will be
continued. Nevertheless the DA5 consortium does not foresee availability of a
reliable lead-free package technology for power semiconductor components on short
term
Material evaluations continue in close cooperation with material suppliers, but
semiconductor component qualifications, material supplier conversions and equipment
conversions can only begin after a reliable lead-free package technology is available
Customer qualifications (TIER1 and OEM) and supply chain conversion / ramp can
only begin after package technology and semiconductor component qualification
No single drop-in lead-free solution is visible! Different applications will need different
solutions. It’s likely that some application fields will not be covered by lead-free solutions and
therefore need continued exemption
Based on current status, DA5 cannot predict a date for customer sampling. As shown
in the previous two slides, the release process will take a substantial amount of time