39 4 August, 2015
Substitute Material(s) for High-Lead Solders
DA5 - Industrial Release Process(RoHS)
DA Material
Technology
Package
Semiconductor
Component
Customer Application
Material
Supplier
Assembly
Semiconductor
Company
System Supplier
Supply
chain
Technology
chain
DA Material
Development
Package
Development
Prototype Supply
DA5
scope
Lead-free
Package
Technology
Lead-free
Component
Lead-free
Product
Material freeze
iterative
process
typ. 1 ½ years
Lead-free
Die Attach
Material
Assessment
Physics of failure
Workability, Reliability
Manufacturability
typ. 1 ½ years
type
release
additional time required
until product is commercially available