29 4 August, 2015
TLPS material II
The hybrid material showed a medium
space rate. The spaces are filled with
epoxy material
The reflow process is very critical and has
to be further optimized, the reflow profile
seems to be product specific
Reliability results are contradictory.
Results are package / leadframe material
dependent. A high metal / epoxy rate
needed to survive reliability
Shear values at 260°C are low, but reach
the minimum needed value (5N/mm
2
)
Strong brittle intermetallic phase growth
with Cu
Potential usage for SIP and clip packages
Epoxy material
Metal material