28 4 August, 2015
TLPS materials I
Principle
Advantages
Fulfills many of the drop-in replacement
requirements for a paste
Better cost position compared to Ag sintering
solutions
Good electrical performance on Ag-plated
leadframes
Disadvantages
Medium metal content in die attach
Medium space rate, filled with Epoxy
New concept in molded packaging - no prior
knowledge of feasibility or reliability
Only suitable for medium dies < 24 mm
2
Potential compatibility issue with Cu
leadframes
Elevated risks
Potential limitations as die attach for high
power devices (low electrical and thermal
conductivity compared to Pb solder)
Potential reliability issues: spaces lead to
cracks in die attach