24 4 August, 2015
Conductive Adhesives III
Limitations
Some highly filled adhesives contain solvents to improve rheology. This requires more careful handling and
control of the manufacturing process. It also bears a risk of leadframe and die surface contamination.
Material cost is higher compared to standard adhesives and solder alloy.
Process window depends on die size with maximum die sizes up to 8x8mm².
Application is limited to low and medium power devices and maximum moisture sensitivity level MSL3/260°C.
Scanning acoustic microscopy shows
delamination of large power transistor die
attach after 1000cyces TC -50°C / +150°C
Dispense
Patterns
No solvent bleed out
Visible solvent bleed out