23 4 August, 2015
Conductive Adhesives II
Advantages
Good adhesion to different types of chip backside metals and leadframe platings.
Good thermal and electrical performance.
Common production methods and equipment can be used for the application of the material and
placement of the chip (Drop-In Solution)
Box oven curing in Nitrogen atmosphere with standard equipment.
Pass automotive environment stress test conditions (AEC-Q100, AEC-Q101).
Comparison of transient thermal resistance of
highly silver filled adhesive vs. high-lead soft
solder and sintered silver materials.
Scanning acoustic microscopy shows
no delamination of die attach after
2000cycles TC -50°C / +150°C.