22 4 August, 2015
Conductive Adhesives I
Principle
High electrical and thermal conductivity of adhesives is achieved by increasing silver filler content and
very dense packing of filler particles. Reduction of particle size to micro and nano scale stimulates a
sintering of the silver particles during the resin cure process.
The remaining resin content is a key factor determining the physical properties of the material. The
transition form an adhesive with very low resin content to a pure Ag-sinter material is fluent.
Hybrid adhesive/sinter materials combine the advantages of an silver filled adhesive (thermal-
mechanical stability, low sensitivity to surfaces) with the high conductivity of an Ag-sintered material.
Cross-section of a highly filled adhesive with
dense packing of silver particles in the bond
line.
Silicon Chip
Leadframe
Cross-section of an adhesive with
sintered silver particles (dark spots are
remaining resin content).
Silicon Chip
Leadframe