20 4 August, 2015
Reliability Requirements *
AEC-Q100/-Q101 Grade 0
Typical T
junction
175°C; max. up to 200°C
Thermal/electrical properties
Improvement compared to existing solutions needed
Reflow 260°C (SMD)
Moisture sensitivity level MSL3 or better (SMD)
Wire bonding temp. up to 260°C
Physics of failure understood
The full specification document “DA5 Pb-Free Die-Attach Material Requirements” is
available upon request at DA5 (contact last page).
*= Requirements may be slightly different for different applications