15 4 August, 2015
DA5 Project
Decision to form DA5 consortium in 04/2009
DA5 focus on the use of high melting solder in semiconductor
applications, especially for die attach in power packages.
Other applications covered in ELV Annex2, exemption 8e are out of
DA5 scope and might have other requirements.
DA5 = Die-Attach 5
Members of DA5 consortium