Specifications

2 Maxim Integrated
HDCP Gigabit Multimedia Serial
Link Serializer/Deserializer
MAX9263/MAX9264
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
AVDD to AGND
MAX9263 ............................................................ -0.5V to +1.9V
MAX9264 ............................................................ -0.5V to +3.9V
DVDD to GND (MAX9263) ...................................-0.5V to +1.9V
DVDD to DGND (MAX9264) .................................-0.5V to +3.9V
IOVDD to GND (MAX9263) ..................................-0.5V to +3.9V
IOVDD to IOGND (MAX9264) ..............................-0.5V to +3.9V
Any Ground to Any Ground .................................-0.5V to +0.5V
OUT+, OUT- to AGND (MAX9263) ......................-0.5V to +1.9V
IN+, IN- to AGND (MAX9264) ..............................-0.5V to +1.9V
LMN_ to AGND (MAX9263)
(15mA current limit) ..........................................-0.5V to +3.9V
All Other Pins to GND (MAX9263) ...... -0.5V to (V
IOVDD
+ 0.5V)
All Other Pins to IOGND (MAX9264) ... -0.5V to (V
IOVDD
+ 0.5V)
Continuous Power Dissipation (T
A
= +70NC )
64-Pin TQFP (derate 31.3mW/NC above +70NC) .....2507.8mW
Operating Temperature Range ........................ -40NC to +105NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
PACKAGE THERMAL CHARACTERISTICS (Note 1)
64 TQFP-EP
Junction-to-Ambient Thermal Resistance (B
JA
) ...........31.9NC/W
Junction-to-Case Thermal Resistance (B
JC
) .....................1NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
MAX9263 DC ELECTRICAL CHARACTERISTICS
(V
AVDD
= V
DVDD
= 1.7V to 1.9V, V
IOVDD
= 1.7V to 3.6V, R
L
= 100I Q1% (differential), T
A
= -40NC to +105NC, unless otherwise noted.
Typical values are at V
AVDD
= V
DVDD
= V
IOVDD
= 1.8V, T
A
= +25NC.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
SINGLE-ENDED INPUTS (DIN_, PCLKIN, SD, SCK, WS, AUTOS, MS, CDS, PWDN, SSEN, DRS, ES, BWS)
High-Level Input Voltage V
IH1
DIN_, PCLKIN, AUTOS, MS, CDS, SSEN,
DRS, ES, BWS
0.65 x
V
IOVDD
V
SD, SCK, WS
0.7 x
V
IOVDD
Low-Level Input Voltage V
IL1
0.35 x
V
IOVDD
V
Input Current I
IN1
V
IN
= 0 to V
IOVDD
-10 +10
FA
Input Clamp Voltage V
CL
I
CL
= -18mA -1.5 V
SINGLE-ENDED OUTPUT (INT)
High-Level Output Voltage V
OH1
I
OUT
= -2mA
V
IOVDD
- 0.2
V
Low-Level Output Voltage V
OL1
I
OUT
= 2mA 0.2 V
OUTPUT Short-Circuit Current I
OS
V
O
= V
GND
V
IOVDD
= 3.0V to 3.6V 16 35 64
mA
V
IOVDD
= 1.7V to 1.9V 3 12 21
I
2
C/UART, I/O, AND OPEN-DRAIN OUTPUTS (RX/SDA, TX/SCL, LFLT)
High-Level Input Voltage V
IH2
0.7 x
V
IOVDD
V
Low-Level Input Voltage V
IL2
0.3 x
V
IOVDD
V