Data Sheet

NCP1117, NCV1117
http://onsemi.com
2
MAXIMUM RATINGS
Rating Symbol Value Unit
Input Voltage (Note 1) V
in
20 V
Output Short Circuit Duration (Notes 2 and 3) − Infinite −
Power Dissipation and Thermal Characteristics
Case 318H (SOT−223)
Power Dissipation (Note 2)
Thermal Resistance, Junction−to−Ambient, Minimum Size Pad
Thermal Resistance, Junction−to−Case
Case 369A (DPAK)
Power Dissipation (Note 2)
Thermal Resistance, Junction−to−Ambient, Minimum Size Pad
Thermal Resistance, Junction−to−Case
P
D
R
q
JA
R
q
JC
P
D
R
q
JA
R
q
JC
Internally Limited
160
15
Internally Limited
67
6.0
W
°C/W
°C/W
W
°C/W
°C/W
Maximum Die Junction Temperature Range T
J
−55 to 150 °C
Storage Temperature Range T
stg
−65 to 150 °C
Operating Ambient Temperature Range
NCP1117
NCV1117
T
A
0 to +125
−40 to +125
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM), Class 2, 2000 V
Machine Model (MM), Class B, 200 V
Charge Device Model (CDM), Class IV, 2000 V.
2. Internal thermal shutdown protection limits the die temperature to approximately 175°C. Proper heatsinking is required to prevent activation.
The maximum package power dissipation is:
P
D
+
T
J(max)
* T
A
R
qJA
3. The regulator output current must not exceed 1.0 A with V
in
greater than 12 V.