AutoStore nvSRAM Specification Sheet
Table Of Contents
- Features
- Functional Description
- Pin Configurations
- Device Operation
- SRAM Read
- SRAM Write
- AutoStore Operation
- AutoStore Inhibit mode
- Hardware STORE (HSB) Operation
- Hardware RECALL (Power Up)
- Data Protection
- Noise Considerations
- Hardware Protect
- Low Average Active Power
- Preventing Store
- Best Practices
- Maximum Ratings
- Operating Range
- DC Electrical Characteristics
- Data Retention and Endurance
- Capacitance
- Thermal Resistance
- AC Test Conditions
- AutoStore or Power Up RECALL
- Switching Waveform
- Ordering Information
- Document History Page
- Sales, Solutions, and Legal Information
STK22C48
Document Number: 001-51000 Rev. ** Page 13 of 14
Package Diagrams
Figure 13. 28-Pin (300 mil) SOIC (51-85026)
Figure 14. 28-Pin (330 mil) SOIC (51-85058)
PIN 1 ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATING PLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
114
15 28
*
*
*
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85026-*D
51-85058-*A
[+] Feedback