SoftStore nvSRAM Specification Sheet
Table Of Contents
- Features
- Functional Description
- Logic Block Diagram
- Pin Configurations
- Device Operation
- SRAM Read
- SRAM Write
- Software STORE
- Software RECALL
- Hardware RECALL (Power Up)
- Hardware Protect
- Noise Considerations
- Low Average Active Power
- Best Practices
- Maximum Ratings
- Operating Range
- DC Electrical Characteristics
- Data Retention and Endurance
- Capacitance
- Thermal Resistance
- AC Test Conditions
- Switching Waveforms
- Switching Waveforms
- STORE INHIBIT or Power Up RECALL
- Switching Waveforms
- Software Controlled STORE/RECALL Cycle
- Switching Waveforms
- Part Numbering Nomenclature
- Ordering Information
- Document History Page
- Sales, Solutions and Legal Information
STK11C88
Document Number: 001-50591 Rev. ** Page 13 of 15
Package Diagrams
Figure 11. 28-Pin (300 mil) SOIC (51-85026)
51 85127 *A
PIN 1 ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATING PLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
114
15 28
*
*
*
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85026-*D
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