Specifications
Table Of Contents
- Features
- Logic Block Diagram
- Contents
- PSoC Functional Overview
- Getting Started
- Development Tools
- Designing with PSoC Designer
- Document Conventions
- Pinouts
- Registers
- Electrical Specifications
- Packaging Information
- Development Tool Selection
- Ordering Information
- Document History Page
- Sales, Solutions, and Legal Information

CY8C24223A, CY8C24423A
Document Number: 38-12029 Rev. *L Page 15 of 34
Absolute Maximum Ratings
Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested.
Operating Temperature
Table 9. Absolute Maximum Ratings
Symbol Description Min Typ Max Units Notes
T
STG
Storage Temperature -55 +25 +125 C Higher storage temperatures
reduce data retention time.
Recommended storage temper-
ature is +25°C ± 25°C. Storage
temperatures above 65C
degrades reliability. Maximum
combined storage and opera-
tional time at +125°C is 7000
hours.
T
BAKETEMP
Bake Temperature – 125 See
package
label
C
T
BAKETIME
Bake Time See
package
label
– 72 Hours
T
A
Ambient Temperature with Power Applied -40 – +125 C
Vdd Supply Voltage on Vdd Relative to Vss -0.5 – +6.0 V
V
IO
DC Input Voltage Vss - 0.5 – Vdd + 0.5 V
V
IOZ
DC Voltage Applied to Tri-state Vss - 0.5 – Vdd + 0.5 V
I
MIO
Maximum Current into any Port Pin -25 – +25 mA
ESD Electro Static Discharge Voltage 2000 – – V Human Body Model ESD.
LU Latch up Current – – 200 mA
Table 10. Operating Temperature
Symbol Description Min Typ Max Units Notes
T
A
Ambient Temperature -40 – +125 C
T
J
Junction Temperature -40 – +135 C The temperature rise from
ambient to junction is package
specific. See Thermal Imped-
ances on page 29. The user
must limit the power
consumption to comply with this
requirement.