Specifications

CY8C21123/CY8C21223/CY8C21323
Document Number: 38-12022 Rev. *Y Page 34 of 46
Thermal Impedances
Solder Reflow Specifications
Table 37 shows the solder reflow temperature limits that must not be exceeded.
Table 36. Thermal Impedances per Package
Package Typical 
JA
[26]
8-pin SOIC 186 °C/W
16-pin SOIC 125 °C/W
16-pin QFN 46 °C/W
20-pin SSOP 117 °C/W
24-pin QFN
[27]
40 °C/W
Table 37. Solder Reflow Specifications
Package Maximum Peak Temperature (T
C
) Maximum Time above T
C
– 5 °C
8-pin SOIC 260 °C 30 seconds
16-pin SOIC 260 °C 30 seconds
16-pin QFN 260 °C 30 seconds
20-pin SSOP 260 °C 30 seconds
24-pin QFN 260 °C 30 seconds
Notes
26. T
J
= T
A
+ POWER × 
JA
27. To achieve the thermal impedance specified for the QFN package, refer to "Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF)
Packages" available at http://www.amkor.com.
28. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5 °C with Sn-Pb or 245+/-5 °C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.