Specifications

CY8C24123A
CY8C24223A
CY8C24423A
Document Number: 38-12028 Rev. *V Page 51 of 71
Packaging Information
This section illustrates the packaging specifications for the CY8C24x23A PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, see the emulator pod drawings at http://www.cypress.com/design/MR10161.
Packaging Dimensions
Figure 17. 8-Pin (300-Mil) PDIP
51-85075 *D