Specifications

CY7C6431x
CY7C6434x
CY7C6435x
Document Number: 001-12394 Rev. *R Page 29 of 40
Package Diagram
This section illustrates the packaging specifications for the enCoRe V USB device, along with the thermal impedances for each
package.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the enCoRe V emulation tools and their dimensions, refer to the development kit.
Packaging Dimensions
Figure 18. 16-pin Chip On Lead (3 × 3 × 0.6 mm) LG16A/LD16A (Sawn) Package Outline, 001-09116
001-09116 *I