User manual
CY8C27143, CY8C27243
CY8C27443, CY8C27543, CY8C27643
Document Number: 38-12012 Rev. *O Page 47 of 53
Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 45. Solder Reflow Peak Temperature
Package
Silicon A* Silicon B*
Minimum Peak
Temperature**
Maximum Peak
Temperature
Minimum Peak
Temperature*
Maximum Peak
Temperature
8 PDIP 220
o
C 240
o
C 240
o
C 260
o
C
20 SSOP 220
o
C 240
o
C 240
o
C 260
o
C
20 SOIC 220
o
C 240
o
C 220
o
C 260
o
C
28 PDIP 220
o
C 240
o
C 240
o
C 260
o
C
28 SSOP 220
o
C 240
o
C 240
o
C 260
o
C
28 SOIC 220
o
C 240
o
C 220
o
C 260
o
C
44 TQFP 220
o
C 240
o
C 220
o
C 260
o
C
48 SSOP 220
o
C 240
o
C 220
o
C 260
o
C
48 QFN 220
o
C 240
o
C 240
o
C 260
o
C
*Refer to Table 47 on page 50.
**Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220
±
5
o
C
with Sn-Pb or 245
±
5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.
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