User manual

CY8C27143, CY8C27243
CY8C27443, CY8C27543, CY8C27643
Document Number: 38-12012 Rev. *O Page 46 of 53
Figure 30. 48-Pin (7x7 mm) QFN
Important Note For information on the preferred dimensions for mounting QFN packages, see the following Application Note at
http://www.amkor.com/products/notes_papers/MLFAppNote.pdf.
Thermal Impedances Capacitance on Crystal Pins
51-85152 *C
Table 43. Thermal Impedances per Package
Package Typical θ
JA
*
8 PDIP 120
o
C/W
20 SSOP 116
o
C/W
20 SOIC 79
o
C/W
28 PDIP 67
o
C/W
28 SSOP 95
o
C/W
28 SOIC 68
o
C/W
44 TQFP 61
o
C/W
48 SSOP 69
o
C/W
48 QFN 18
o
C/W
* T
J
= T
A
+ POWER x θ
JA
Table 44. Typical Package Capacitance on Crystal Pins
Package Package Capacitance
8 PDIP 2.8 pF
20 SSOP 2.6 pF
20 SOIC 2.5 pF
28 PDIP 3.5 pF
28 SSOP 2.8 pF
28 SOIC 2.7 pF
44 TQFP 2.6 pF
48 SSOP 3.3 pF
48 QFN 2.3 pF
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