User manual

CY8C27143, CY8C27243
CY8C27443, CY8C27543, CY8C27643
Document Number: 38-12012 Rev. *O Page 41 of 53
Packaging Information
This section illustrates the packaging specifications for the CY8C27x43 PSoC device, along with the thermal impedances for each
package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the document titled PSoC Emulator Pod Dimensions at
http://www.cypress.com/design/MR10161.
Packaging Dimensions
Figure 21. 8-Pin (300-Mil) PDIP
51-85075 *A
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