Specifications

CY8C24094, CY8C24794
CY8C24894, CY8C24994
Document Number: 38-12018 Rev. AH Page 52 of 64
Figure 20. 100-Pin (14 × 14 × 1.4 mm) TQFP
Important Note
■ For information on the preferred dimensions for mounting QFN packages, see the Application Note, Application Notes for Surface
Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages available at http://www.amkor.com.
■ Pinned vias for thermal conduction are not required for the low power PSoC device.
51-85048 *G