Specifications

CY8C24094, CY8C24794
CY8C24894, CY8C24994
Document Number: 38-12018 Rev. AH Page 48 of 64
13. Packaging Dimensions
This section illustrates the package specification for the CY8C24x94 PSoC devices, along with the thermal impedance for the package
and solder reflow peak temperatures.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod dimension drawings at http://www.cypress.com/design/MR10161.
Figure 15. 56-Pin (7 × 7 × 0.6 mm) QFN
001-58740 *A