Specifications

CY8C24094, CY8C24794
CY8C24894, CY8C24994
Document Number: 38-12018 Rev. AH Page 44 of 64
10.5 Thermal Impedance
10.6 Solder Reflow Peak Specifications
Tab le 38 shows the solder reflow temperature limits that must not be exceeded.
Table 37. Thermal Impedances per Package
Package Typical 
JA
[29]
56-Pin QFN
[30]
12.93 °C/W
68-Pin QFN
[30]
13.05 °C/W
100-Ball VFBGA 65 °C/W
100-Pin TQFP 51 °C/W
Table 38. Solder Reflow Specifications
Package
Maximum Peak
Temperature (T
C
)
Maximum Time
above T
C
– 5 °C
56-Pin QFN 260 °C 30 seconds
68-Pin QFN 260 °C 30 seconds
100-Ball VFBGA 260 °C 30 seconds
100-Pin TQFP 260 °C 30 seconds
Notes
29. T
J
= T
A
+ POWER × 
JA.
30. To achieve the thermal impedance specified for the QFN package, see the Application Notes for Surface Mount Assembly of Amkor's MicroLeadFrame (MLF) Packages
available at http://www.amkor.com.