User manual

CY8C24223A, CY8C24423A
Document Number: 38-12029 Rev. *H Page 29 of 34
Figure 16. 28-Pin (210-Mil) SSOP
Thermal Impedances Capacitance on Crystal Pins
Solder Reflow Peak Temperature
The following table lists the minimum solder reflow peak temperature to achieve good solderability.
51-85079 *C
Package Typical θ
JA
[17]
20 SSOP 117
o
C/W
28 SSOP 101
o
C/W
Notes
17. T
J
= T
A
+ POWER x θ
JA
18. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5
o
C with Sn-Pb or 245 ± 5
o
C with Sn-Ag-Cu
paste. Refer to the solder manufacturer specifications.
Package Package Capacitance
20 SSOP 2.6 pF
28 SSOP 2.8 pF
Package Minimum Peak Temperature
[18]
Maximum Peak Temperature
20 SSOP 240
o
C 260
o
C
28 SSOP 240
o
C 260
o
C
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