User manual

CY8C24223A, CY8C24423A
Document Number: 38-12029 Rev. *H Page 28 of 34
Packaging Information
This section illustrates the packaging specifications for the automotive CY8C24x23A PSoC device, along with the thermal impedances
for each package and the typical package capacitance on crystal pins.
Important Note Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of
the emulation tools’ dimensions, refer to the drawings at http://www.cypress.com/design/MR10161.
Figure 15. 20-Pin (210-Mil) SSOP
51-85077 *C
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