Datasheet

CY8C21x34B
Document Number: 001-67345 Rev. *E Page 34 of 49
Packaging Information
This section shows the packaging specifications for the CY8C21x34B PSoC device with the thermal impedances for each package.
Important Note Emulation tools may require a larger area on the target PCB than the chip's footprint. For a detailed description of
the emulation tools' dimensions, refer to the emulator pod drawings at http://www.cypress.com.
Figure 15. 16-Pin (150-Mil) SOIC
Figure 16. 20-Pin (210-Mil) SSOP
51-85068 *E
51-85077 *E