DATASHEET SEARCH SITE

April 20, 2005 Document No. 38-12025 Rev. *G 33
CY8C21x34 Final Data Sheet 4. Packaging Information
4.3 Solder Reflow Peak Temperature
Following is the minimum solder reflow peak temperature to achieve good solderability.
Table 4-2. Solder Reflow Peak Temperature
Package Minimum Peak Temperature* Maximum Peak Temperature
16 SOIC
240
o
C 260
o
C
20 SSOP
240
o
C 260
o
C
28 SSOP
240
o
C 260
o
C
32 MLF
240
o
C 260
o
C
*Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220+/-5
o
C
with Sn-Pb or 245+/-5
o
C with Sn-Ag-Cu paste. Refer to the solder manufacturer specifications.